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Xbox 360: Professional GPU, CPU and RAM Reballing Video Training
Original price was: 99,99 $.49,99 $Current price is: 49,99 $.
The “Xbox 360 Reballing Training” course at BGA Training Online offers comprehensive instruction on reballing techniques for Xbox 360 consoles. This training covers the essential tools and materials, step-by-step reballing procedures, troubleshooting, and best practices for achieving successful repairs. Ideal for technicians and enthusiasts, the course aims to enhance skills and knowledge in reballing, ensuring effective and reliable console repairs.
Description
Course Information:
| Course: | Xbox 360: Professional GPU, CPU and RAM Reballing Video Training |
| Author: | Karol Włodarczyk, UKENtv |
| Release Date: | 2024-01-14 (version 1.0) |
| Duration: | 2h 10min |
| Language: | English |
| Subtitles: | No |
| Video Format: | WMV (Windows Media Video) |
| Version: | 1.0 |
| Digital Download Version
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Course Description:
| Reballing performed in the Xbox 360 console is not an easy task. This course will show you step-by-step how to perform it, without damaging the console. Perfectly solder the GPU, CPU and RAM. It gives you the opportunity to become the best professional service company in the field of Microsoft XBox 360. |
Video Samples:
Course Overview:
- Introduction
- The best and safe equipment used for the reballing process
- Calibration and settings of the Achi IR-PRO rework station
- The GPU Unit
- First stage – Preparation
- Using the aluminium tape to protect the elements on the board (especially capacitors)
- Preventing the board from bending
- Second stage – Removing the GPU
- Heating the motherboard and the unit in order to remove the GPU unit
- Precise temperature profile and explenation of its importance
- How to determine when the GPU Unit is ready to be removed
- Removing the GPU Unit from the motherboard
- Removing the old solder from the motherboard
- Third Stage – the GPU unit
- Removing the old solder from the GPU Unit
- Perfect soldering of new balls to the processor with the usage of stencils
- Fourth Stage – Soldering back the GPU unit
- Soldering back the GPU Unit
- Precise temperatures and length for the soldering process
- Making sure that the GPU has been soldered properly
The CPU Unit
- First stage – Preparation
- Using the aluminium tape to protect the elements on the board (especially capacitors)
- Preventing the board from bending
- Second stage – Removing the CPU
- Heating the motherboard and the unit in order to remove the CPU unit
- Precise temperature profile and explenation of its importance
- How to determine when the CPU Unit is ready to be removed
- Removing the CPU Unit from the motherboard
- Removing the old solder from the motherboard
- Third Stage – the CPU unit
- Removing the old solder from the CPU Unit
- Perfect soldering of new balls to the processor with the usage of stencils
- Fourth Stage – Soldering back the CPU unit
- Soldering back the CPU Unit
- Precise temperatures and length for the soldering process
- Making sure that the CPU has been soldered properly
- First stage – Preparation
- The RAM Unit
- First stage – Preparation
- Using the aluminium tape to protect the elements on top of the board
- The RAM to be reballed is on the bottom side of the motherboard (harder task to perform!)
- Preventing the board from bending
- Second stage – Removing the RAM
- Heating the motherboard and the unit in order to remove the RAM unit
- Precise temperature profile and explenation of its importance
- How to determine when the RAM Unit is ready to be removed
- Removing the RAM Unit from the motherboard
- Removing the old solder from the motherboard
- Third Stage – the RAM unit
- Removing the old solder from the RAM Unit
- Perfect soldering of new balls to the RAM memory with the usage of stencils
- Precise correction of small 0,5 balls
- Fourth Stage – Soldering back the RAM unit
- Soldering back the RAM Unit
- Precise temperatures and length for the soldering process
- Making sure that the RAM has been soldered properly
- First stage – Preparation
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